Research and Markets has announced the addition of the “Thermal Interface Materials 2015-2025: Status, Opportunities, Market Forecasts” report to their offering.
Overheating is the most critical issue in the computer industry. It limits further miniaturization, power, performance and reliability. The escalation of power densities in electronic devices has made efficient heat removal a crucial issue for progress in information, communication, energy harvesting, energy storage and lighting technologies. As long as electronic systems aren’t monolithic, but are built from a wide range of materials such as metals, polymers, ceramics and semiconductors, there will be a need for thermal interface materials.
The contact area between high power, heat generating components and heat sinks can be as low as 3 percent, due to the micro-scale surface roughness. Thermal interface materials are required to enhance the contact between the surfaces, and decrease thermal interfacial resistance, and increase heat conduction across the interface.
Proper selection of Thermal Interface Materials (TIM) is crucial for the device efficiency. Instead of sophisticated cooling technique, it is often better to invest in the interface material. Without good thermal contact, the use of expensive thermally conducting materials for the components is a waste.
Innovation in this industry is driven forward by:
- Faster computers: With electronic systems becoming faster, hotter, more compact, and portable, the need for better TIMs in consumer and industrial computing will continue.
- Greener lighting: LEDs are replacing traditional lighting in more applications, for lower energy and higher brightness, especially in the automotive industry.
- Electrification of transport: Heat management is of very high importance in electric vehicles, which have large energy storage systems. As vehicles incorporate more and more electrics and electronics, thermal management will become increasingly important.
- Better connectivity: As a wider-reaching and more comprehensive wireless network is built, and higher reliability is expected, more, better quality TIM is being used in telecommunications equipment.
For more information visit http://www.researchandmarkets.com/research/pn3lsw/thermal_interface